Shenzhen Benqiang Circuits Co,Ltd.
Shenzhen Benqiang Circuits Co,Ltd.
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HDI with 3+N+3
| Project | PCB process capability |
|---|---|
| Layer count | 1-40 Layers |
| Min outer line width/space | 3/3mil |
| Outer copper thickness | 280um(8OZ) |
| Inner copper thickness | 210um(6OZ) |
| Tolerance of PCB thickness | board thickness≤1.0mm; ±0.1mm,+/-0.05mm below 4 layers board thickness＞1.0mm; ±10% |
| Minimum PTH | Mechanical hole 4mil, laser 3mil |
| Material | FR-4 ,High Tg ,Halogen-free ,PTFE ,Rogers,Polyimide |
| HDI | Levels 2-7 |
| Special Process |
Buried blind vias, blind slots, rigid-flex combination,mixed pressure, back drilling, buried resistance,buriedcapacitance, milling steps, multi-combination impedance; |